Bush Clover
Cast Your Ideas into Shape

Plating / Electroforming
Plating / Electroforming
Mold production by Cu / Ni plating / electroforming


■ Realization of fine three-dimensional MEMS structure by plating ・ Vertical fine plating with a pattern width of several tens of μm or more is possible.
The resist (resin) pattern created by electron beam patterning, laser patterning, photolithography, etc. cannot be used as a mold as it is. With Bush Clover, it is possible to manufacture fine and precise molds on the order of 100 nm and inexpensive and easy-to-replace molds on the order of several μm using electroforming and plating technologies.
Due to our unique low-temperature plating technology, the heat applied to the resist is small, so changes in the resist shape can be minimized. From thin film plating of about 50 μm, plating of 1000 μm (= 1 mm) or more, which is impossible with normal plating, is possible.
In addition, by applying this technology, it is possible to manufacture metal molds from films with uneven patterns on the surface, silicon, glass, etc., and aspherical lenses, Fresnel lenses, light guide plates, prism sheets, optical mirrors, etc. Compatible with various optical molds.